Niaj hnub no, peb yuav qhia lwm qhov zoo ntawm daim ntawv thov ntawm silicon carbide tiaj tus -cov ntawv membranes. Silicon carbide tiaj tus-cov ntaub ntawv cov ntaub ntawv ua ke nrog cov txheej txheem sludge hauv MBRs sawv cev qis-flux ua haujlwm scenarios (tsim flux 25 ~ 60 LMH, pov tseg pov tseg 25 LMH, dej phwj hauv tsev 60 LMH). Hloov pauv, silicon carbide tiaj tus-cov ntawv nyias nyias kuj muaj ntau qhov txiaj ntsig zoo siab -flux ua haujlwm scenarios (tsim flux 150 ~ 1000 LMH).
Piv nrog rau qis-flux ua haujlwm scenarios, silicon carbide tiaj tus-cov ntaub ntawv daim nyias nyias yog tus nqi ntau dua- ua tau zoo nyob rau hauv siab -flux lag luam scenarios.
Niaj hnub no, peb yuav tsom mus rau daim ntawv thov ntawm silicon carbide tiaj tus- daim ntawv membranes hauv siab - cov dej khib nyiab hauv kev lag luam semiconductor.
Cov hauv paus ntsiab lus ntawm siab - dej khib nyiab hauv kev lag luam semiconductor yog:
1. Ntxuav cov dej khib nyiab tom qab wafer sib tsoo thiab dicing (backside thinning kom txo wafer thickness; dicing wafers rau hauv chips)
2. Ntxuav cov dej khib nyiab tom qab kev npaj
Planarization thev naus laus zis hauv kev lag luam semiconductor hu ua CMP (Chemical Mechanical Polishing). Lub hauv paus ntsiab lus ntawm CMP (Nruam Polishing) yog tig lub wafer txheeb ze rau polishing ncoo nyob rau hauv lub xub ntiag ntawm ib tug abrasive slurry (xws li KOH cov tshuaj uas muaj colloidal SiO2 tshem tawm hais) thaum thov siab, yog li ua tiav polishing los ntawm kev sib tsoo thiab tshuaj etching. Cov thev naus laus zis no yuav nthuav dav los ntawm cov phiaj xwm kev sib txuas ntawm cov hluav taws xob sib txuas (ILDs), insulators, conductors, embedded hlau (W, Al, Cu, Au), polysilicon, thiab silicon oxide channels hauv kev lag luam semiconductor mus rau qhov chaw ua haujlwm xws li nyias- zaj duab xis cia disks, microelectromechanical systems, mfm. li qub, iav kho qhov muag, thiab cov khoom siv hlau.
Cov yam ntxwv ntawm siab -turbidity dej khib nyiab los ntawm kev lag luam semiconductor yog raws li nram no:
1. High turbidity, feem ntau yog vim muaj cov ntsiab lus siab ntawm cov khoom zoo.
2. Tsawg conductivity thiab qis TOC.
3. CMP dej khib nyiab muaj oxidizing zog.
Los ntawm qhov pom ntawm daim nyias nyias fouling, qhov fouling yam tsuas yog siab siab ntawm cov khoom zoo. Txoj kev ntxuav lub cev muaj txiaj ntsig zoo rau kev tsim cov membrane flux. Tsawg conductivity thiab qis TOC txhais tau tias tsis tshua muaj siab rau cov organic fouling thiab scaling, ua rau cov tshuaj ntxuav lub voj voog ntev.
Qhov no yog qhov zoo tshaj plaws daim ntawv thov scenario rau membrane sib cais tshuab! Nws yog qhov tsim nyog rau kev ua haujlwm ntawm kev pom thawj zaug!
High concentrations ntawm nplua particle teeb meem txhais tau hais tias siab khiav velocities ntawm lub membrane nto ua rau ib tug tas mus li kev pheej hmoo ntawm mechanical coj mus rau lub membrane sib cais txheej.
Qhov zoo ntawm submerged ultrafiltration tshuab siv silicon carbide tiaj daim ntawv membranes rau siab -turbidity dej khib nyiab hauv kev lag luam semiconductor:
1. High flux: membrane flux Ntau dua lossis sib npaug ntawm 300 LMH, tus nqi qis peev;
2. Kev siv hluav taws xob tsawg: kev ua haujlwm qis thiab kev tu tus nqi;
3. Tus nqi rov qab siab (txog Ntau dua lossis sib npaug li 95%), piv rau 75% ~ 85% rau cov organic membranes.